G894-SD3-AAX7
HPC/AI Server - Intel® Xeon® 6 Processors - 8U DP NVIDIA HGX™ B300
- NVIDIA HGX™ B300
- 8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet GPU networking ports
- via onboard NVIDIA ConnectX®-8 SuperNIC™
- 1.8TB/s GPU-to-GPU bandwidth with NVIDIA NVLink™ and NVSwitch™
- Dual Intel® Xeon® 6700/6500-Series Processors
- 8-Channel DDR5 RDIMM / MRDIMM, 32 x DIMMs
- Compatible with NVIDIA® BlueField®-3 DPUs
- 2 x 10Gb/s LAN ports via Intel® X710-AT2
- 2 x M.2 slots with PCIe Gen5 x4 and x2 interface
- 8 x 2.5" Gen5 NVMe hot-swap bays
- 4 x FHHL PCIe Gen5 x16 slots
- 12 x 3000W 80 PLUS Titanium redundant power supplies
- Ordering Numbers: 6NG894SD3DR000AAX7*
Boosting Individual Applications with On-Point Features
Intel® Xeon® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it's high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.
Core Technology Aligned with Aspirations
Acceleratorsbuilt-in*
Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators
8 or 12Channels
Increased memory frequency and throughput with DDR5 RDIMM support
PCIe 5.0lanes
Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators
CXL 2.0support**
Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region
Up to 288E-cores per CPU
Core dense and optimized efficiency for cloud-native and hyperscale workloads
Up to 128P-cores per CPU
Greater core performance with improved TCO, accelerating AI and compute intensive workloads
MRDIMMsupport
Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level
* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel's official website or contact technical support for details.
** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.
Select GIGABYTE for the latest Gen Intel Xeon Platform
High CPU Performance
The best in computational performance relies on a system well designed by our engineers to adequately dissipate heat to achieve peak performance.
Energy Efficiency
Our engineers have baked in features to achieve higher efficiency from power supplies and server fans. Along with Titanium and Platinum offerings.
Optimal Price
GIGABYTE releases multiple product models and configurations to target exactly what users want without paying for extra features that go unused.
Ease of Administration
GIGABYTE servers come with GIGABYTE Management Console for server management. Using a web based browser remotely is key to easing management.
Continuous Operation
Systems are rigorously designed and tested to ensure downtime will not occur. Customers have come to expect stable performance.
G894-SD3-AAX7 Product Overview
G894-SD3-AAX7 Block Diagram
High Performance
Supports NVIDIA HGX™ B300
NVIDIA HGX™ B300 is built for the age of AI reasoning with enhanced compute and increased memory. Featuring 7X more AI compute than Hopper platforms, 2.1TB of HBM3E memory, and high-performance networking integration with NVIDIA® ConnectX®-8 SuperNICs, Blackwell Ultra delivers breakthrough performance on the most complex workloads from agentic systems and reasoning, to real time video generation for every data center.
Power Efficiency
Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
Hardware Security
Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
User Friendly
Full-Height Add-In Cards
Support full-height add-in cards on all PCIe expansion slots to accommodate DPUs and SuperNICs.
Easy Maintenance
PCIe cage design and front-access motherboard/GPU trays for streamlined maintenance.
Flexible PSU Configuration
Hot-swappable, fully redundant PSUs with multiple connector options for enhanced flexibility.
Tool-less Drive Bays Design
Clipping mechanism secures the drive in place. Install or replace a new drive in seconds.
Certified Ready with Software Partners
Being a member of key software alliance partner programs enables GIGABYTE to rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization.
High Availability
Smart Ride Through (SmaRT)
To prevent server downtime and data loss as a result of loss of AC power, GIGABYTE implements SmaRT in all our server platforms. When such an event occurs, the system will throttle while maintaining availability and reducing power load. Capacitors within the power supply can supply power for 10-20ms, which is enough time to transition to a backup power source for continued operation.
Smart Crises Management and Protection (SCMP)
SCMP is a GIGABYTE patented feature which is deployed in servers with non-fully redundant PSU design. With SCMP, in the event of faulty PSU or overheated system, the system will force the CPU into an ultra-low power mode that reduces the power load, which prevents the system from unexpected shutdown and avoids component damage or data loss.
Dual ROM Architecture
If the ROM that stores the BMC and BIOS fails to boot, the system will reboot with the backup BMC and/or BIOS replacing the primary. Once the primary BMC is updated, the ROM of the backup BMC will automatically update the backup through synchronization. For the BIOS, it can be updated based on user's choice of firmware version.
Value-added Management
GIGABYTE offers free-of-charge management applications via a specialized small processor built on the server.
GIGABYTE Management Console
For management and maintenance of a server or a small cluster, users can use the GIGABYTE Management Console, which is pre-installed on each server. Once the servers are running, IT staff can perform real-time health monitoring and management on each server through the browser-based graphical user interface. In addition, the GIGABYTE Management Console also provides:
- Support for standard IPMI specifications that allows users to integrate services into a single platform through an open interface
- Automatic event recording, which can record system behavior 30 seconds before an event occurs, making it easier to determine subsequent actions
- Integrate SAS/SATA/NVMe devices and RAID controller firmware into GIGABYTE Management Console to monitor and control Broadcom® MegaRAID adapters.
[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
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Dimensions (WxHxD, mm)
- 8U
447 x 351 x 923
- 8U
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Motherboard
- MSB4-PE2
-
CPU
- Intel® Xeon® 6 Processors
- Intel® Xeon® 6700-Series Processors
- Intel® Xeon® 6500-Series Processors
Dual processor, TDP up to 350W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
- Intel® Xeon® 6 Processors
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Socket
- 2 x LGA 4710
Socket E2
- 2 x LGA 4710
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Chipset
- System on Chip
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Memory
- 32 x DIMM slots
Support DDR5 RDIMM/MRDIMM [1]
8-Channel memory per processor
RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC)
MRDIMM: Up to 8000 MT/s
[1] MRDIMMs are only supported with Intel® Xeon® 6 Processors with P-cores and in a 1DPC configuration.
- 32 x DIMM slots
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LAN
- Front (I/O board - CFPG440):
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
- Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear:
8 x 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™
Rear (MLAN board - CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
- Front (I/O board - CFPG440):
-
Video
- Integrated in ASPEED® AST2600
- 1 x VGA port
- Integrated in ASPEED® AST2600
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Storage
- Front hot-swap:
8 x 2.5" Gen5 NVMe
- (NVMe from PEX89072)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
- Front hot-swap:
-
Modular GPU
- NVIDIA HGX™ B300 with 8 x SXM GPUs
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PCIe Expansion Slots
- PCIe Bridge Board - CPBG045 x 2:
4 x FHHL x16 (Gen5 x16), from PEX89072
- PCIe Bridge Board - CPBG045 x 2:
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Front I/O
- I/O board - CFPG440:
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
- I/O board - CFPG440:
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Rear I/O
- 8 x OSFP ports
MLAN board - CDB66:
1 x MLAN port
- 8 x OSFP ports
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Security Modules
- 1 x TPM header with SPI interface
- Optional TPM2.0 kit: CTM012
- 1 x TPM header with SPI interface
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Power Supply[#1]
- 12 x 3000W 80 PLUS Titanium redundant power supplies [1]
AC Input:
- 115-127V~/ 14.2A, 50-60Hz
- 200-220V~/ 15.8A, 50-60Hz
- 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
- 240Vdc/ 14A
DC Output:
- Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
- Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
- Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
- 12 x 3000W 80 PLUS Titanium redundant power supplies [1]
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System Fans
- Motherboard:
2 x 60x60x56mm
4 x 60x60x76mm
OSFP ports:
4 x 40x40x56mm
PCIe slots:
2 x 80x80x56mm
GPU tray:
15 x 80x80x80mm
- Motherboard:
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Operating Properties
- Operating temperature: 10°C to 30°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
- Operating temperature: 10°C to 30°C
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Packaging Dimensions
- 1200 x 800 x 620 mm
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Packaging Content
- 1 x G894-SD3-AAX7
2 x CPU heatsinks
4 x Carriers
1 x L-shape Rail kit
- 1 x G894-SD3-AAX7
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Part Numbers
- - Barebone with NVIDIA module: 6NG894SD3DR000AAX7*
- Motherboard: 9MSB4PE2UR-000*
- L-shape Rail kit: 25HB2-UM6100-K0R
- CPU heatsink: 25ST1-323208-A0R
- Front panel board - CFPG440: 9CFPG440NR-00*
- Backplane board - CBPG641: 9CBPG641NR-00*
- Fan module 40x40x56mm: 25ST2-405630-S1R
- Fan module 60x60x56mm: 25ST2-665623-S1R
- Fan module 60x60x76mm: 25ST2-667621-A0R
- Fan module 80x80x56mm: 25ST2-885622-A0R
- Fan module 80x80x80mm: 25ST2-888038-A0R
- PCIe bridge board - CPBG045: 9CPBG045NR-00*
- Rear MLAN board - CDB66: 9CDB66NR-00*
- Power supply: 25EP0-203K01-D0S
- - Barebone with NVIDIA module: 6NG894SD3DR000AAX7*
